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NIST Advanced Packaging Summit

Semiconductor packaging can be incredibly boring. That said, advanced packaging is a key to every high-complexity semiconductor – both on and off the planet. Nvidia, AMD, and Intel have all utilized chiplets and advanced packages

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Turbocharging AI During CES

This blog post was originally published at Ambarella’s website. It is reprinted here with the permission of Ambarella. Innovation was the focus of our exhibition during this year’s CES, with the theme of Turbocharged AI.

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News

DEEPX

DEEPX Expands First-generation AI Chips into Intelligent Security and Video Analytics Markets

Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this momentum at Secutech Taipei, Embedded Vision Summit, and COMPUTEX 2024. TAIPEI and SEOUL, South Korea, April 23, 2024 /PRNewswire/ — DEEPX, an on-device AI semiconductor company, is announcing plans to expand

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Basler

dart M: Basler Presents Modular, Board Level Camera

With the new dart M with GigE interface, the leading international manufacturer of high-quality cameras and matching image processing hardware and software enables its customers to assemble board level cameras according to the modular principle. Ahrensburg, April 23, 2024 – Basler AG presents the dart M , a customizable, cost-efficient, board level camera with GigE

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AIRY3D

Airy3D and Teledyne e2v Collaboration Delivers More Affordable 3D Vision Solutions

GRENOBLE, France, April 23, 2024 (GLOBE NEWSWIRE) — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, is pleased to announce a new technology and design collaboration with Airy3D (Montreal, Canada), a leading 3D vision solution provider. The first result of this partnership is the co-engineering of the recently announced

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Market Analysis

Market Analysis

NIST Advanced Packaging Summit

Semiconductor packaging can be incredibly boring. That said, advanced packaging is a key to every high-complexity semiconductor – both on and off the planet. Nvidia, AMD, and Intel have all utilized chiplets and advanced packages for their latest AI/ML accelerators and processors. Without 2.5D and 3D design and assembly techniques, these and many other essential

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Automotive

Here’s Why the SDV Market Will Be Worth $700 Billion by 2034

The SDV and AI Cars market is set to be worth over US$700 billion by 2034, representing around 20% of the global car market, according to IDTechEx‘s “Software-Defined Vehicles, Connected Cars, and AI in Cars 2024-2034” report. That sum can be sourced from several areas, such as monthly connectivity subscriptions, commission from in-vehicle payments, and

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Blog

Algorithms

The Building Blocks of AI: Decoding the Role and Significance of Foundation Models

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. These neural networks, trained on large volumes of data, power the applications driving the generative AI revolution. Editor’s note: This post is part of the AI Decoded series, which demystifies AI by making the technology more accessible,

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Blog Posts

Pixelation Artifact in Microscopic Imaging and Their Prevention Methods Using Advanced Camera Features

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. In microscopic imaging, pixelation is one of the most commonly occurring artifacts, as the camera subjects are micro-level. Pixelation artifact occurs when the magnification surpasses an image sensor’s capabilities, by which indistinct pixel boundaries appear.

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Blog Posts

Revolutionizing Offline Advertising With Smart Signages and Embedded Vision

This blog post was originally published at TechNexion’s website. It is reprinted here with the permission of TechNexion. The retail landscape has changed significantly in recent years, propelled by technological advancements. The COVID-19 pandemic posed new challenges to traditional retail spaces, which resulted in the need for more innovative communication mediums. To offer customers memorable

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